Glass-Based 3D Packaging
Glass-based 3D packaging replaces conventional silicon and organic interposers with a substrate that is electrically superior, mechanically stable, and scalable to panel-level production. At Zhongke Daojing, we have built a complete system-packaging line around Through-Glass Via (TGV) technology — from micro-via formation and metal filling through surface redistribution, wafer-level bonding, and final performance testing.
- Complete process chain — via formation, metallization, multi-layer RDL, bonding, dicing, and test, all in-house.
- Wafer and panel formats — 2″ to 12″ wafers and panels up to 510 × 510 mm.
- Proven hermeticity — conductive-silicon TGV wafers with leak rates below 1 × 10⁻¹¹ Pa·m³/s.
Glass-Based 3D Packaging by the Numbers
System Packaging Process
Via Formation & Filling
Sub-20μm through-glass vias formed by laser-induced etching, then filled by paste, electroplating, or resin-plug routes.Surface Metallization & RDL
Single- and multi-layer redistribution on the TGV substrate surface, with ball placement for flip-chip or BGA interconnect.Wafer-Level Bonding
Laser welding, anodic bonding, and gold-to-gold thermocompression qualified for high-reliability package assembly.Dicing & Performance Test
Precision wafer dicing followed by electrical, mechanical, and hermeticity testing on every production lot.Core Capabilities
Through-Glass Via (TGV)
Sub-20μm vias formed in batch across borosilicate, alkali-free, high-alumina silicate, and fused silica substrates. Positional tolerance held inside ±3μm.Microvia Metal Filling
Four fill routes — low-temperature paste, high-temperature paste, electroplate-thicken with resin plug, and fully electroplated copper.Surface Metallization & Multi-Layer RDL
Single- and multi-layer redistribution wiring on the TGV substrate, with solder ball placement for flip-chip or BGA interconnect.Wafer-Level Bonding
Laser welding, anodic bonding, and Au-Au thermocompression for die attach, cap sealing, and hermetic packaging at wafer level.Conductive-Silicon TGV
Glass high-temperature reflow recombines glass and silicon into a hybrid conductive-silicon TGV wafer for high-isolation and high-vacuum builds.Testing & Verification
Electrical, mechanical, and hermeticity testing on every lot. Helium leak testing, bond-strength pull/shear, and full continuity data ship with each order.Process Platform Overview
| Platform Area | In-House Capability |
|---|---|
| TGV formation | Sub-20μm vias; vertical, tapered, and oblong profiles; 2″–12″ wafers and panels up to 510 × 510 mm |
| Metallization & filling | Paste fill, electroplate-thickening with resin plug, and fully electroplated copper routes |
| RDL & bumping | Single- and multi-layer redistribution wiring with solder ball placement for flip-chip or BGA interconnect |
| Bonding | Laser welding, anodic bonding, and Au-Au thermocompression |
| Verification | Electrical continuity, mechanical pull/shear, and helium leak testing with production data |
Target Applications
For designs where high-density vertical interconnect, low-loss signal routing, and stable glass packaging determine device performance.MEMS & Inertial Sensors
Hermetic, CTE-matched glass packaging for gyroscopes, accelerometers, and pressure sensors requiring vacuum or controlled-atmosphere cavities. Discuss applicationRF & Millimeter-Wave Devices
Low-loss glass interposers that preserve signal integrity through dense vertical interconnect, replacing lossy silicon in filter, antenna, and front-end module packages. Discuss applicationDisplay, CPO & Brain-Computer Interfaces
High-density 3D integration on transparent glass substrates for co-packaged optics, Mini-LED backplanes, and next-generation neural interface arrays. Discuss applicationSend Your Drawing for a Quote
Share your via geometry, substrate format, bonding requirements, and target test data. Our engineering team will review feasibility and DFM before sampling.Precision special glass for demanding applications
Custom materials, CNC processing, coating, inspection, and packing support for industrial, optical, electronic, and high-temperature glass projects.
Featured Glass Capabilities
Custom Processed Glass Components
Plates, discs, rings, spacers, slots, holes, polished edges, and shaped glass parts manufactured according to your drawing.
View moreHigh Temperature Glass Solutions
Borosilicate, quartz, ROBAX-style glass ceramic, and sight glass options for lighting, ovens, furnace windows, and thermal cycling.
View moreOptical & Electronic Substrates
Quartz, borosilicate, optical glass, coated substrates, display cover glass, ITO/FTO options, and thin glass processing support.
View moreSpecial glass solutions for OEM projects
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Send a drawing, sample photo, or rough size. We can help confirm the material, processing route, tolerance, edge finish, and packing before quotation.