Choice for Precision Glass Micro-Drilling
Femtosecond laser micro-drilling works differently from mechanical drilling and conventional laser processes. Because the pulse duration is shorter than the thermal diffusion time of glass, energy is deposited and removed before heat can spread into the surrounding material — producing holes with clean, amorphous walls, no heat-affected zone, and no subsurface damage.
This is the process of choice for hole diameters below 100 µm, hard-to-machine materials such as quartz and Gorilla Glass, and applications where hole-wall quality directly affects device performance. TGVGlass holds tight diameter tolerances across large arrays, processes multiple glass families, and supports round, square, and custom profiles.
Glass Micro-Drilling Applications We Support
Application-specific hole geometry, diameter, pitch, and edge quality from single ports to dense wafer-level arrays.
Microfluidic Chip Channel Holes
Chip-free inlet, outlet, and port holes in borosilicate and quartz from 50 µm upward, with hole-to-channel alignment within ±5 µm for lab-on-chip devices, diagnostic cartridges, and cell-culture platforms.
Probe Card Guide Plate Holes
Fine-pitch guide plate arrays from 20 µm diameter with diameter tolerance within ±3 µm and pitch accuracy within ±2 µm for advanced logic and memory wafer testing.
Multiwell Plate Holes
96-well, 384-well, and custom-format borosilicate plates with hole placement accuracy within ±10 µm and chip-free rims suited to automated liquid handling.
Fiber Alignment Array Holes
Single-row and 2D arrays in borosilicate, quartz, and alkali-free glass. Diameter is matched to the fiber cladding, with ±3 µm diameter tolerance and ±2 µm pitch accuracy.
Glass Nozzle & Needle Holes
Straight, taper-free axial holes from 20 µm upward for inkjet nozzle plates, microinjection needles, micropipette tips, and fluid-dispensing nozzles.
TGV Substrate Via Arrays
Dense via arrays from 20 µm in borosilicate, alkali-free, and quartz glass, with clean amorphous walls ready for metal filling and surface RDL routing.
Need Help?
Contact us if your application is not listed, or if your hole geometry or glass material requires a custom evaluation.
Glass Materials & Brands
Specify the material your device requires. We process stock from leading manufacturers instead of limiting designs to a fixed substrate catalogue.
Borosilicate Glass
Corning 7740, SCHOTT BOROFLOAT® 33, and AGC Borosilicate. Excellent chemical resistance and thermal stability.
Minimum hole diameter: 20 µm
Aluminosilicate Glass
Corning Gorilla® Glass and SCHOTT Xensation® for high-strength cover glass, touch panels, and consumer electronics.
Minimum hole diameter: 20 µm
Quartz / Fused Silica
Corning HPFS®, SCHOTT Lithosil®, and AGC Techno Glass for optical, UV, and high-temperature applications.
Minimum hole diameter: 20 µm
Display / TFT Glass
Corning Eagle XG®, AGC AN100, and NEG OA-10G ultra-flat, low-alkali glass for display backplanes and semiconductor processing.
Minimum hole diameter: 20 µm
Alkali-Free Glass
Corning Eagle XG® and SCHOTT AF 32® eco for semiconductor and MEMS packages sensitive to ion migration.
Minimum hole diameter: 20 µm
Ultra-Thin Glass (UTG)
Corning Willow® and SCHOTT Ultra-thin Glass from 0.03 mm thickness for foldable displays and wearable sensors.
Minimum hole diameter: 30 µm
Hole Profiles Available: Round · Square · Rectangular · Hexagonal · Custom shapes
Custom Glass Micro-Drilling
Every job is configured to the hole diameter, profile, array geometry, and glass material specified by the customer. We do not limit projects to fixed hole sizes or array formats.
What We Need to Quote
- Glass material and brand or equivalent specification
- Glass thickness
- Hole diameter and profile
- Hole-to-hole pitch and array layout in DXF, DWG, or Gerber
- Required dimensional tolerance
- Target quantity and delivery format
Dimensional Capabilities
Femtosecond laser drilling for precision wafer, panel, and singulated glass formats.
| Parameter | Capability |
|---|---|
| Minimum Hole Diameter | 20 µm; 30 µm for ultra-thin glass |
| Dimensional Tolerance | ±3 µm; ±5 µm for ultra-thin glass |
| Glass Thickness Range | 0.03 mm – 5 mm |
| Maximum Wafer / Panel Size | 12 in. wafer / 510 mm × 510 mm panel |
| Hole Profiles | Round, square, rectangular, hexagonal, and customer-specified custom shapes |
| Edge Quality | Chip-free walls with no heat-affected zone or micro-cracking |
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