TGV & Precision Glass Manufacturing Platform
TGVGlass is a precision glass manufacturing and TGV advanced packaging company based in Hefei, Anhui, China. We specialize in the development and production of glass wafers, precision glass microstructures, Through Glass Via substrates, and customized glass components for semiconductor, photonics, MEMS, biomedical, display, and advanced research applications.
Our capabilities extend from precision glass preparation and microfabrication to TGV advanced packaging. We provide glass laser cutting, wafer processing, microvia formation, microstructure fabrication, metal via filling, multilayer RDL routing, wafer bonding, dicing, and related inspection services.
Beyond TGV substrates, we also manufacture application-specific glass components including microfluidic chips, V-groove glass substrates for fiber arrays, glass multiwell plates, precision cover glass, quartz components, and other custom microstructured glass devices.
Our engineering team supports projects from material selection and design review through prototyping and production, allowing customers to develop both individual precision glass components and complete glass-based packaging structures through a single manufacturing partner.
Why TGVGlass Is Different
TGVGlass combines advanced TGV packaging technology with precision glass manufacturing under one platform.
Our core strength is the ability to process glass not only as a conventional substrate, but as a functional engineering material for microelectronic, optical, fluidic, and packaging applications.
For TGV applications, we support glass microvia formation down to 20 µm with positional tolerances within ±3 µm, together with metal filling, RDL routing, wafer bonding, and conductive silicon TGV structures.
For precision glass manufacturing, we process borosilicate glass, aluminosilicate glass, quartz and fused silica, alkali-free glass, ultra-thin glass, and other technical glass materials into wafers, microchannels, precision cut components, optical alignment structures, and custom microstructured devices.
This combination allows us to support projects at different levels — from a single custom glass component to a complete wafer-level packaging structure.
Prototype development, engineering evaluation, and production can all be handled within the same manufacturing workflow.
We Provide Customized Glass & TGV Manufacturing Services
Our work is primarily custom manufacturing.
Instead of offering only fixed standard products, our engineering team works from customer drawings, material requirements, target dimensions, process conditions, and final applications to determine the appropriate manufacturing route.
We support projects including:
- TGV glass wafers and substrates
- Glass microvia formation and metal filling
- Glass microstructure and microchannel fabrication
- Precision glass laser cutting
- Borosilicate and quartz wafer processing
- Microfluidic glass chips and devices
- V-groove glass substrates for fiber arrays
- Glass multiwell and microwell plates
- MEMS and semiconductor cover glass
- Optical and photonic glass components
- Custom glass components for research and industrial applications
From early prototypes and process verification to batch production, customers work with one engineering team throughout the project.
Connect with our experts
We’re here to help
Tell our engineering team about your substrate, via, filling, RDL, bonding, testing, quantity, and delivery requirements.
Quote Form
Send the inputs needed for an initial TGV packaging process review.