Precision in Glass Laser Cutting
We specialize in precision laser cutting of technical glass using laser-induced stealth dicing and laser scribing technologies. Our capabilities cover glass thicknesses from 0.1 mm to 5 mm, standard wafers from 2 in. to 12 in., and panels up to 510 × 510 mm.
Depending on material and part geometry, dimensional tolerances can reach ±20 µm, with selected display glass applications reaching ±15 µm and ultra-thin glass applications reaching ±10 µm.
TGVGlass supports custom glass cutting from prototype quantities through production runs. Finished components are inspected for dimensions, edge quality, and surface condition before shipment.
Glass Laser Cutting Capability
Wafer and panel cutting across standard, display, and ultra-thin technical glass formats.
| Project | Capability |
|---|---|
| Materials | Borosilicate, aluminosilicate, quartz / fused silica, display / TFT glass, alkali-free glass, UTG |
| Standard Thickness | 0.1–5 mm |
| Ultra-Thin Glass | Down to 0.03 mm |
| Wafer Size | 2 in.–12 in. |
| Maximum Panel Size | 510 × 510 mm |
| Dimensional Tolerance | Within ±20 µm |
| Display / TFT Glass | Down to ±15 µm |
| Ultra-Thin Glass Tolerance | Down to ±10 µm |
| Edge Options | Flat, chamfered, polished |
| Inspection | Dimensional, edge, and surface inspection |
Glass Cutting Products We Make
Precision-cut substrates, covers, chips, and ultra-thin components supplied to the dimensions required by the next process step.
TGV Glass Substrates
Borosilicate, alkali-free, and quartz glass cut into precise wafer and panel formats for TGV advanced packaging, from 2 in. to 12 in. and custom panels up to 510 × 510 mm.
Semiconductor Cover Glass
Precision-cut borosilicate and aluminosilicate cover components for semiconductor, sensor, MEMS, and vacuum packages in wafer-round or custom rectangular formats.
Microfluidic Glass Chips
Borosilicate and quartz blanks for microfluidic and lab-on-chip devices, with precise external dimensions for subsequent channel processing, alignment, and bonding.
Display & Ultra-Thin Glass
TFT, alkali-free, and ultra-thin glass for display and touch applications, reaching ±15 µm on selected display glass and ±10 µm on suitable UTG applications.
Need Help?
Contact us if you require a different glass material, thickness, size, or custom cutting geometry.
Custom Glass Laser Cutting
Our precision glass cutting services are available for standard and custom components. Glass material, thickness, dimensions, tolerances, and edge requirements can be specified according to your drawing and application.
We support borosilicate, aluminosilicate, quartz / fused silica, TFT, alkali-free, and ultra-thin glass. Parts can be supplied with flat, chamfered, or polished edges where required.
Laser Cutting & Inspection Capabilities
Controlled cutting, measurement, inspection, documentation, and packaging within one service flow.
Laser Stealth Dicing
Wafer-format glass from 0.1 mm to 5 mm, processed for controlled separation and clean component edges.
Laser Scribing
Panel-format technical glass up to 510 × 510 mm for standard and custom component geometries.
Dimensional Measurement
Optical dimensional measurement with ±5 µm measurement resolution and inspection reports available on request.
Edge & Surface Inspection
Microscopic chipping and crack inspection plus post-cut surface cleanliness verification.
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We’re Here to Help
Send us your glass drawing, material, thickness, dimensions, tolerance, quantity, and application requirements for a custom quotation.
Quote Form
Send the cutting inputs needed for an initial process and inspection review.