Through-glass vias combine low-loss dielectric performance with fine-pitch vertical connectivity. Successful designs begin with a balanced relationship between glass thickness, via diameter, pitch, aspect ratio, and the intended metallization sequence.
Early process reviews help teams align electrical targets with manufacturable tolerances, reduce iteration, and define inspection criteria before volume scaling.
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| 页面 | 选用模板 | 原因 |
|---|---|---|
| Microstructure Processing | Aspheric Lenses | 有6种独立加工类型（凹槽/斜孔/光纤孔/凸台等）适合用系列卡片展示；有干/湿/喷砂三步工艺流程可以做Design Process段 |
| Conductive Silicon TGV | Aspheric Lenses | 有多个子产品变体（真空封装晶圆/陀螺仪封装晶圆/气体传感晶圆）适合用系列卡片；有完整的”玻璃高温回流键合”工艺流程可以展开 |
| Glass-Based Packaging | Spherical Lenses | 有横向可比的三种键合方式参数（气密性/热影响/适用场景）适合规格对比表；各工序（微孔→填充→RDL→键合→切割→测试）有明确子类适合分类卡片 |
| RDL Routing | Spherical Lenses | 有明确参数（线宽/层数/公差）适合规格表；有三类芯片方案（逻辑/存储/计算）适合分类卡片；行业应用明确适合行业段 |
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