Through-Glass Via Design Rules for High-Density Interconnects
A practical overview of via geometry, pitch, metallization, and reliability considerations for glass interposer programs.
作者： <span>1111</span>
Selecting Glass Substrates for Advanced Packaging
How composition, thickness, surface quality, and thermal behavior influence downstream packaging performance.
From Microvia Formation to Copper Filling: A Process Overview
Key controls for forming, conditioning, metallizing, and verifying conductive microvias in glass.